Session: VIB-13-01: Passive and Active Control of Vibration, Shock, and Noise
Paper Number: 91039
91039 - Memetic Optimizer for Structural Damage Identification Using Electromechanical Admittance
Electromechanical impedance-based (EMI) techniques using piezoelectric transducers are promising for structural damage identification. They can be implemented in high frequency range with small characteristic wavelengths, leading to high detection sensitivity. The impedance measured is the outcome of harmonic and stationary excitation, which makes it easier to conduct inverse analysis for damage localization and quantification. Nevertheless, the EMI data measurement points are usually limited, thus oftentimes resulting in an under-determined problem. To address this issue, damage identification process can be converted into a multi-objective optimization formulation which naturally yields multiple solutions. While this setup fits the nature of damage identification that a number of possibilities may exist under given observations/measurements, existing algorithms may suffer from premature convergence and entrapment in local extremes. Consequently, the solutions found may not cover the true damage scenario. To tackle these challenges, in this research, a series of local search strategies are tailored to enhance the global searching ability and incorporated into particle swarm-based optimization. The Q-table is utilized to help the algorithm select proper local search strategy based on the maximum Q-table values. Case studies are carried out for verification, and the results show that the proposed memetic algorithm achieves good performance in damage identification.
Presenting Author: Yang Zhang University of Connecticut
Presenting Author Biography: Yang Zhang is a Ph.D. student in Department of Mechanical Engineering, University of Connecticut.
Authors:
Yang Zhang University of ConnecticutKai Zhou Michigan Technological University
Jiong Tang University of Connecticut
Memetic Optimizer for Structural Damage Identification Using Electromechanical Admittance
Paper Type
Technical Paper Publication